Joseph Toumanios | Mechanical Engineer

This project required an internal heat source and tested how various materials would react as an overall assembly.  Microchips can run complex tasks, but have a tenancy to crash if they exceed a certain temperature.  This simulation allowed me to assign the materials and run the transient thermal analysis on the entire unit as well as an individual circuit board in the microchip.  I determined that the system can reach up to 186.25 degrees Celsius.  This may mean that based off the overall specs, we may require a heat sink or some form of forced convection to allow continued operation.